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Heat Sink Paste | 25 g | Tube

  • Article code: HSPA25T
  • Vendor Part Number: HSPA25T
  • EAN number: 5412810306329


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Product description

Heat sink compound suitable for PCBs in transistors, for diodes, CPUs etc.
Use it between -50 °C and 180 °C
25 g compound tube type.

General information

Thermal Conductivity :>3.2Watt/m-k
Thermal Impedance:<0.06 degree C-in2/Watt
Operation Temperture:-50~180 C


Product specifications
Content 25 g


Retail package dimensions (Polybag)
Width Height Length
30 mm 30 mm 20 mm


Important links

Quality documents

Via the link you can see the Technical Construction File. It contains all quality documents, if available. For example: the CE Declaration of Conformity (DoC), Material Safety Data Sheet (MSDS) and quality certificates.

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