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Heat Sink Paste | 25 g | Injection

  • Article code: HSPA25I
  • Vendor Part Number: HSPA25I
  • EAN number: 5412810306343


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Product description

Heat sink compound suitable for PCBs in transistors, for diodes, CPUs etc.
Use it between -50 °C and 180 °C
25 g compound injection type.

General information

Thermal Conductivity :>3.2Watt/m-k
Thermal Impedance:<0.06 degree C-in2/Watt
Operation Temperture:-50~180 C


Product specifications
Weight 25 g


Retail package dimensions (Polybag)
Width Height Length
30 mm 30 mm 30 mm


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