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Heat Sink Paste | 25 g | Tube

  • Article code: HSPA25T
  • Vendor Part Number: HSPA25T
  • EAN number: 5412810306329


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Product description

Heat sink compound suitable for PCBs in transistors, for diodes, CPUs etc.
Use it between -50 °C and 180 °C
25 g compound tube type.

General information

Thermal Conductivity :>3.2Watt/m-k
Thermal Impedance:<0.06 degree C-in2/Watt
Operation Temperture:-50~180 C


Product specifications
Content 1 pc
Packaging Polybag


Retail package dimensions (Polybag)
Width Height Length
30 mm 30 mm 20 mm
Logistic dimensions
Packed per Width Height Length Weight
1 30 mm 15 mm 90 mm 40 g
10 95 mm 35 mm 135 mm 300 g
330 340 mm 150 mm 450 mm 10340 g
660 360 mm 345 mm 480 mm 21460 g


Important links

Quality documents

Via the link you can see the Technical Construction File. It contains all quality documents, if available. For example: the CE Declaration of Conformity (DoC), Material Safety Data Sheet (MSDS) and quality certificates.

See all documents

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