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Heat Sink Paste | 1.0 g | Injection | 8 pcs

  • Article code: HSPA01I
  • Vendor Part Number: HSPA01I
  • EAN number: 5412810306336


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Product description

Heat sink compound suitable for PCBs in transistors, for diodes, CPUs etc.
Use it between -50 °C and 180 °C
1 g compound injection type
8 injections per bag

Package contents

8x injection

General information

Thermal Conductivity :>3.2Watt/m-k
Thermal Impedance:<0.06 degree C-in2/Watt
Operation Temperture:-50~180 C


Product specifications
Content 8 pcs
Packaging Bag


Retail package dimensions (Polybag)
Width Height Length
90 mm 90 mm 20 mm
Logistic dimensions
Packed per Width Height Length Weight
1 70 mm 15 mm 100 mm 23 g
8 70 mm 15 mm 100 mm 23 g
96 195 mm 65 mm 150 mm 273 g


Important links

Quality documents

Via the link you can see the Technical Construction File. It contains all quality documents, if available. For example: the CE Declaration of Conformity (DoC), Material Safety Data Sheet (MSDS) and quality certificates.

See all documents

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