Logo Nedis

Heat Sink Paste | 25 g | Injection

  • Article code: HSPA25I
  • Vendor Part Number: HSPA25I
  • EAN number: 5412810306343


Find the nearest store or webshop.

Where to buy

Business customer?

Register for exclusive access to our full assortment and pricing .

sign up in a few minutes


Product description

Heat sink compound suitable for PCBs in transistors, for diodes, CPUs etc.
Use it between -50 °C and 180 °C
25 g compound injection type.

General information

Thermal Conductivity :>3.2Watt/m-k
Thermal Impedance:<0.06 degree C-in2/Watt
Operation Temperture:-50~180 C


Product specifications
Content 1 pc
Packaging Polybag


Retail package dimensions (Polybag)
Width Height Length
30 mm 30 mm 30 mm
Logistic dimensions
Packed per Width Height Length Weight
1 215 mm 30 mm 55 mm 39 g
6 250 mm 30 mm 175 mm 235 g
96 340 mm 160 mm 450 mm 4200 g
192 360 mm 350 mm 485 mm 9220 g


Important links

Quality documents

Via the link you can see the Technical Construction File. It contains all quality documents, if available. For example: the CE Declaration of Conformity (DoC), Material Safety Data Sheet (MSDS) and quality certificates.

See all documents

Display all products in:
Components » Paste

You've selected 0 out of 0 products to compare. (select one more)

Back to top